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CEI EN 60749-15 : 2012

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
Available format(s)

Hardcopy , PDF

Superseded date

10-16-2021

Language(s)

English

Published date

01-01-2012

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 General
3 Test apparatus
4 Materials
5 Procedure
6 Summary
Bibliography

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-45. (01/2006) Supersedes CEI EN 60749. (05/2008)
DocumentType
Standard
Pages
14
PublisherName
Comitato Elettrotecnico Italiano
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
IEC 60749-15:2010 Identical
EN 60749-15:2010/AC:2011 Identical

IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

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PDF - English
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