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CEI EN 60749-8 : 2004

Current
Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 8: SEALING
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2004

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 General terms
4 Bomb pressure test
5 Fine leak detection: radioactive
   krypton method
6 Fine leak detection: tracer
   gas (helium) method with
   mass spectrometer
7 Gross leaks, perfluorocarbon
   vapour method using electronic
   detection apparatus
8 Gross leak - Perfluorocarbon - bubble
   detection method
9 Test condition E, weight-gain
   gross-leak detection
10 Penetrant dye gross leak detection
11 Gross leak re-test

Pertains to semiconductor devices (discrete devices and integrated circuits).

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-36. (01/2005) Supersedes CEI EN 60749. (05/2008)
DocumentType
Standard
Pages
26
PublisherName
Comitato Elettrotecnico Italiano
Status
Current
Supersedes

Standards Relationship
EN 60749-8:2003 Identical
IEC 60749-8:2002 Identical

EN 60068-2-17:1994 Environmental testing - Part 2: Tests - Test Q: Sealing
IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing

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