Name: CEI EN 62047-25 : 1ED 2017
Brand: CEI

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA

Published date

08-08-2017

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Requirements
5 Testing method
Annex A (informative) - Dimensions for testing structure and
        tensile/compressive strength
Annex B (informative) - Pull-press testing method example
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Defines the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS).

Committee	CT 309
DevelopmentNote	Classificazione CEI 47-140. (08/2017)
DocumentType	Standard
PublisherName	Comitato Elettrotecnico Italiano
Status	Current

Standards	Relationship
IEC 62047-25:2016	Identical

EN 62047-1:2016	Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
IEC 62047-1:2016	Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
ISO 10012:2003	Measurement management systems — Requirements for measurement processes and measuring equipment
EN ISO 10012:2003	Measurement management systems - Requirements for measurement processes and measuring equipment (ISO 10012:2003)