CEI EN 62047-9 : 2012
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
Hardcopy , PDF
English
01-01-2012
FOREWORD
1 Scope
2 Normative references
3 Measurement methods
Annex A (informative) - Example of bonding force
Annex B (informative) - An example of the fabrication
process for three-point bending specimens
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
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