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CEI EN 62326-1 : 2002

Current
Current

The latest, up-to-date edition.

PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
Available format(s)

Hardcopy , PDF

Language(s)

English - Italian

Published date

01-01-2002

INTRODUCTION
1 Scope
2 Normative references
3 General
3 1 General considerations
3 2 Structure of the specification series
4 Particular stipulations
5 Capability approval and maintenance of capability
  approval
6 Quality assessment
7 Rules for the preparation of detail specifications
Annex A (informative) - Examples of a CDS check list
Annex B (informative) - Future Structure of the specification
        series
Annex C (informative) - Structure of the capability qualifying
        component (CQC)
Annex D (informative) - Abbreviations and acronyms related to
        IECQ and their explanations
Annex E (informative) - Guide to the form and content of a
        capability manual
Annex F (informative) - Example of process description
Annex G (informative) - Example of limits of approval
Annex H (informative) - Example of description of capability
Annex I (informative) - Example of manufacturer-to-customer
Annex J (informative) - Example of CQC detail specification
Annex K (informative) - Example of test programme matrix
Annex L (informative) -Example of test programme schedule
Annex M (normative) - Requirements for capability approval
        test reports
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Describes capability approval (CA) procedures for printed boards.When IECQ recognition is required, the capability approval procedures of IEC 001002 should be used.

Committee
CT 309
DevelopmentNote
Classificazione CEI 52-19 (08/2001)
DocumentType
Standard
Pages
64
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN 62326-1:2002 Identical
IEC 62326-1:2002 Identical

IEC 61249-2-12:1999 Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
IECQ 001002-3:2005 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
EN 62326-4-1:1997 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
IECQ 001002-2:1998 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 2: DOCUMENTATION
EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
EN 61249-2-4:2002 Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
EN ISO 9001:2015 Quality management systems - Requirements (ISO 9001:2015)
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
EN 61249-2-12:1999 Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
ISO 9001:2015 Quality management systems — Requirements
IECQ 001002-1:1998 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 1: ADMINISTRATION
IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
IEC 61249-2-4:2001 Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 61182-1:1994 Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form
EN 62326-4:1997 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

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