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CEI EN IEC 62239-1 : 2019

Current
Current

The latest, up-to-date edition.

Process management for avionics - Management plan Part 1: Preparation and maintenance of an electronic components management plan
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

03-15-2019

This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished.

Committee
CT 309
DocumentType
Standard
ISBN
978-2-8322-6033-3
Pages
0
ProductNote
THIS STANDARD ALSO REFERS TO IPC/JEDEC J-STD-20,IECQ OD 3702,IECQ OD 3407-1,IECQ 03-4,ANSI/ESDA/JEDEC JS-001,AS/EN/JISQ 9000,AS/EN/JISQ 9100,AS/EN/JISQ 9110,AS/EN/JISQ 9120,DEF.STAN.00-71,SAE EIA-STD-4899,DLA SMD-5962-87517,GIFAS/5052/2008,IATF 16949,IPC/JEDEC J-STD-020,
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
EN IEC 62239-1:2018 Identical

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