DD IEC/PAS 61249-3-1:2007
Current
The latest, up-to-date edition.
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Hardcopy , PDF
English
10-31-2007
1 Scope
2 Normative references
3 Terms and definitions
4 Designation of copper-clad laminates
4.1 Copper-clad laminate
4.2 Base materials
4.3 Thickness of the base material
4.4 Types of adhesives
4.5 Thickness of base materials and adhesives
4.6 Type of copper foil
4.7 Grade of copper foil
4.8 Copper-foil thickness
4.9 Types of profiles
4.10 Surface treatment to increase copper adhesivity
and anti-rust
4.11 Symbol for flammability
5 Observation
5.1 Base film
5.2 Copper foil
5.3 CCL
6 Size
6.1 Base film
6.1.1 Thickness and its allowance
6.2 Copper foil
6.2.1 Thickness and its allowance
6.3 Adhesives
6.3.1 Adhesives
6.4 Copper-clad laminates
6.4.1 Thickness and its allowance
6.4.2 Sheet dimension and its allowance
6.4.3 Role dimension and its allowance
7 Properties
7.1 Base film
7.2 Copper foil
7.3 CCL
8 Package and labelling
Annex A (normative) Roughness test
Annex B (normative) Dimensional stability test
Appendix - Additional information
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