DD IEC PAS 62686-1 : DRAFT JULY 2011

Name: DD IEC PAS 62686-1 : DRAFT JULY 2011
Brand: BSI

Withdrawn

View Superseded by

PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS

Withdrawn date

10-27-2018

Published date

11-23-2012

Publisher

British Standards Institution

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Abbreviationstions
5 Technical requirements
Annex A (normative) - STACK Specification
S/0001 Issue 14

Specifies the minimum requirements for general purpose 'off the shelf' COTS integrated circuits and discrete semiconductors for high reliability applications.

Committee	GEL/107
DocumentType	Draft
PublisherName	British Standards Institution
Status	Withdrawn
SupersededBy	PD IEC/TS 62686-1:2015

Standards	Relationship
IEC PAS 62686-1:2011	Identical

MIL-STD-883 Revision K:2016	TEST METHOD STANDARD - MICROCIRCUITS
IEC 61340-5-1:2016	Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC TS 62239:2008	Process management for avionics - Preparation of an electronic components management plan
MIL-STD-750 Revision F:2011	TEST METHODS FOR SEMICONDUCTOR DEVICES
EN 100015-3 : 1993	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: REQUIREMENTS FOR CLEAN ROOM AREAS
IPC J STD 004 : B	REQUIREMENTS FOR SOLDERING FLUXES
IPC J STD 033C-1:2014	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IEC TS 62564-1:2016	Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
IPC J STD 035 : 0	ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS