DIN EN 60068-2-69 : 2007

Superseded

ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)

Available format(s)

Hardcopy

Superseded date

01-16-2018

Language(s)

German

Published date

01-01-2007

Publisher

Verband Deutscher Elektrotechniker

DevelopmentNote	Supersedes DIN IEC 60068-2-69. (11/2007) Supersedes DIN EN 60068-2-54. (01/2018)
DocumentType	Standard
Pages	27
PublisherName	Verband Deutscher Elektrotechniker
Status	Superseded
SupersededBy	DIN EN 60068-2-69 : 2018
Supersedes	DIN IEC 60068-2-69:2003-11 (Draft) DIN EN 60068-2-54:2007-01

Standards	Relationship
IEC 60068-2-69:2017	Identical
I.S. EN 60068-2-69:2017	Identical
SN EN 60068-2-69 : 2017	Identical
BS EN 60068-2-69:2017	Identical
UNE-EN 60068-2-69:2007	Identical
VDE 0468-2-69 : 2018	Corresponds
EN 60068-2-69:2017/AC:2018-03	Identical

DIN EN 60068-4:1996-10	ENVIRONMENTAL TESTING - PART 4: INFORMATION FOR SPECIFICATION WRITERS - TEST SUMMARIES
DIN DVS HDBK 196 : 4ED 2001	SCHWEISSTECHNIK 5 - HARTLOETEN, WEICHLOETEN, GEDRUCKTE SCHALTUNGEN

DIN EN 60068-2-2 : 1995	ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-2:2007	Environmental testing - Part 2-2: Tests - Test B: Dry heat
DIN EN 60068-2-20:2009-02	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads (IEC 60068-2-20:2008); German version EN 60068-2-20:2008
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
VDE 0468-1 : 2015	Environmental testing Part 1: General and guidance (IEC 60068-1:2013)
IEC 60068-2-66:1994	Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
ISO 9454-1:2016	Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
VDE 0468-2-2 : 2008	ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT
IPC J STD 002 : D	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
DIN EN 60068-1 : 2015	ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013)
DIN EN 61190-1-3:2015-05 (Draft)	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 60068-3-13:2016	Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60068-2-2:2007	Environmental testing - Part 2-2: Tests - Test B: Dry heat
ISO 9453:2014	Soft solder alloys Chemical compositions and forms
DIN EN 60068-2-66:1995-06	ENVIRONMENTAL TESTING - TEST METHODS - TEST CX: DAMP HEAT, STEADY STATE (UNSATURATED PRESSURIZED VAPOUR)
EN 60068-2-66:1994	Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
EN 61190-1-3:2007/A1:2010	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IPC J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS
IEC 61190-1-3:2007+AMD1:2010 CSV	Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications