EN 60747-15:2012
Current
The latest, up-to-date edition.
Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
03-16-2012
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Letter symbols
5 Essential ratings (limiting values) and
characteristics
6 Measurement methods
7 Acceptance and reliability
Annex A (informative) - Test method of peak case
non-rupture current
Annex B (informative) - Measuring method of the
thickness of thermal compound paste
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
IEC 60747-15:2010 gives the requirements for isolated power semiconductor devices excluding devices with incorporated control circuits.
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Current
|
Standards | Relationship |
NF EN 60747-15 : 2013 | Identical |
IEC 60747-15:2010 | Identical |
NBN EN 60747-15 : 2012 | Identical |
NEN EN IEC 60747-15 : 2012 | Identical |
I.S. EN 60747-15:2012 | Identical |
PN EN 60747-15 : 2012 | Identical |
UNE-EN 60747-15:2012 | Identical |
BS EN 60747-15:2012 | Identical |
CEI EN 60747-15 : 2012 | Identical |
DIN EN 60747-15:2012-08 | Identical |
BS EN 61287-1:2014 | Railway applications. Power converters installed on board rolling stock Characteristics and test methods |
04/30114936 DC : DRAFT JUN 2004 | EN 50439 - RAILWAY APPLICATIONS - RELIABILITY TESTS FOR HIGH POWER SEMICONDUCTORS DEVICES - PART 1: STANDARD BASE-PLATE MODULES |
EN 61287-1:2014/AC:2014 | RAILWAY APPLICATIONS - POWER CONVERTERS INSTALLED ON BOARD ROLLING STOCK - PART 1: CHARACTERISTICS AND TEST METHODS (IEC 61287-1:2014) |
IEC 60112:2003+AMD1:2009 CSV | Method for the determination of the proof and the comparative tracking indices of solid insulating materials |
IEC 60270:2000+AMD1:2015 CSV | High-voltage test techniques - Partial discharge measurements |
IEC 60747-7:2010 | Semiconductor devices - Discrete devices - Part 7: Bipolar transistors |
IEC 61287-1:2014 | Railway applications - Power converters installed on board rolling stock - Part 1: Characteristics and test methods |
EN 60749-15:2010/AC:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
IEC 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
EN 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
EN 60270:2001/A1:2016 | HIGH-VOLTAGE TEST TECHNIQUES - PARTIAL DISCHARGE MEASUREMENTS (IEC 60270:2000/A1:2015) |
EN 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
IEC 60747-9:2007 | Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs) |
EN 60749-21:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY |
IEC 60747-8:2010 | Semiconductor devices - Discrete devices - Part 8: Field-effect transistors |
IEC 60749-15:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
EN 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
EN 60664-1:2007 | Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests |
IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
IEC 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
IEC 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV | Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations |
EN 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
IEC 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
IEC 60747-6:2016 | Semiconductor devices - Part 6: Discrete devices - Thyristors |
EN 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
IEC 60664-1:2007 | Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests |
IEC 60747-2:2016 | Semiconductor devices - Part 2: Discrete devices - Rectifier diodes |
IEC 60749-12:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
EN 60749-12:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
EN 60721-3-3 : 95 AMD 2 97 | CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - CLASSIFICATION OF GROUPS OF ENVIRONMENTAL PARAMETERS AND THEIR SEVERITIES - STATIONARY USE AT WEATHER-PROTECTED LOCATIONS |
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