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EN 61189-1 : 97 AMD 1 2001

Current
Current

The latest, up-to-date edition.

TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
Published date

10-30-2001

FOREWORD
INTRODUCTION
1 Scope and object
2 Normative reference
3 Accuracy, precision and resolution
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
9 M: Mechanical test methods
10 E: Electrical test methods
11 N: Environmental test methods
12 X: Miscellaneous test methods
Annex A - Worked examples
Annex B - Conversion table
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Contains test methods giving methodologies and procedures for application to test materials used in the manufacture of interconnection structures (printed boards) and assemblies.

Committee
SR 91
DocumentType
Test Method
PublisherName
European Committee for Standards - Electrical
Status
Current

BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
EN 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
NF EN 61249 8-8 : 1998 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS
BS EN 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies
I.S. EN 61189-5:2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
I.S. EN 61189-3:2008 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
I.S. EN 61249-8-8:1999 MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER
BS EN 61249-8-8:1997 Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings
BS EN 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies
BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
I.S. EN 61189-6:2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES
BS EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
EN 61249-8-8:1997 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)

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