Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Published date

03-09-2018

Publisher

European Committee for Standards - Electrical

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
5 Requirements
6 Quality assurance provisions
7 Preparation for delivery - Preservation, packing and packaging
Annex A (informative) - Selection of various alloys
        and fluxes for use in electronic soldering - General
        information concerning IEC 61190-1-3
Annex B (normative) - Lead-free solder alloys
Annex C (informative) - Marking method of solder
        designation for mounted board, used in
        electronic equipment
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.This edition includes the following significant technical changes with respect to the previous edition:a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.

Committee	CLC/SR 91
DevelopmentNote	Supersedes EN 61190-1-3. (03/2018)
DocumentType	Standard
PublisherName	European Committee for Standards - Electrical
Status	Current
Supersedes	EN 61190-1-3:2007 EN 61190-1-3:2007/A1:2010

Standards	Relationship
UNE-EN IEC 61190-1-3:2018	Identical
IEC 61190-1-3:2017	Identical
DS/EN IEC 61190-1-3:2018	Identical
SS-EN IEC 61190-1-3:2018	Identical
IEC 61190-1-3:2007+AMD1:2010 CSV	Identical
PN-EN IEC 61190-1-3:2018-05	Identical
CEI EN IEC 61190-1-3:2018	Identical
NEN-EN-IEC 61190-1-3:2018	Identical
SN EN IEC 61190-1-3:2018	Identical
I.S. EN IEC 61190-1-3:2018	Identical
OVE EN IEC 61190-1-3:2018	Identical
NF EN IEC 61190-1-3:2018	Identical
BS EN IEC 61190-1-3:2018	Identical

IEC 61189-5-3:2015	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
IEC 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
EN 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61189-5-2:2015	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
ISO 9454-2:1998	Soft soldering fluxes Classification and requirements Part 2: Performance requirements
ISO 9454-1:2016	Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
EN 61189-5-4:2015	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
EN 61189-5-3:2015	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
IEC 61189-5-4:2015	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
IEC 61190-1-1:2002	Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
ISO 9453:2014	Soft solder alloys Chemical compositions and forms
EN 61190-1-2:2014	Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
ISO 1073-1:1976	Alphanumeric character sets for optical recognition Part 1: Character set OCR-A Shapes and dimensions of the printed image
EN 61189-5-2:2015	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies