SURFACE MOUNT TECHNOLOGY (SMT) REQUIREMENTS FOR EMBEDDED COMMUNICATION MODULES FOR MACHINE TO MACHINE COMMUNICATIONS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

12-15-2014

Publisher

European Telecommunications Standards Institute

Intellectual Property Rights
Foreword
Modal verbs terminology
Introduction
1 Scope
2 References
3 Definitions and abbreviations
4 Physical Form Factor Specifications
5 Electrical Specifications
Annex A (informative) - Interfaces that may be provided
        over General Purpose I/O (GPIO) or General
        Purpose Pads (GPP)
Annex B (informative) - Design guidelines and
        recommendations
Annex C (informative) - Bibliography
History

Defines the SMT pad layout and common interface assignments for essential pads including some general electrical characteristics.

Committee	SMT
DocumentType	Standard
Pages	69
PublisherName	European Telecommunications Standards Institute
Status	Current

ISO 11898-1:2015	Road vehicles — Controller area network (CAN) — Part 1: Data link layer and physical signalling
TS 124 008 : 13.5.0	DIGITAL CELLULAR TELECOMMUNICATIONS SYSTEM (PHASE 2+) (GSM); UNIVERSAL MOBILE TELECOMMUNICATIONS SYSTEM (UMTS); LTE; MOBILE RADIO INTERFACE LAYER 3 SPECIFICATION; CORE NETWORK PROTOCOLS; STAGE 3 (3GPP TS 24.008 VERSION 14.7.0 RELEASE 14)
ISO/IEC 7816-3:2006	Identification cards — Integrated circuit cards — Part 3: Cards with contacts — Electrical interface and transmission protocols
TS 102 221 : 13.0.0	SMART CARDS; UICC-TERMINAL INTERFACE; PHYSICAL AND LOGICAL CHARACTERISTICS (RELEASE 14)
IEEE 1149.1-2013 REDLINE	IEEE Standard for Test Access Port and Boundary-Scan Architecture