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I.S. EN 60068-2-54:2006

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

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withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD

Available format(s)

Hardcopy , PDF

Withdrawn date

04-11-2020

Language(s)

English

Published date

01-01-2006

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the test
5 Description of the test apparatus
   5.1 Test system
   5.2 Solder bath
6 Preconditioning
   6.1 Preparation of specimens
   6.2 Ageing
7 Materials
   7.1 Solder
   7.2 Flux
8 Procedure
   8.1 Test temperature
   8.2 Fluxing
   8.3 Flux drying
   8.4 Test
9 Presentation of results
   9.1 Form of chart-recorder trace
   9.2 Points of significance
   9.3 Reference wetting force
   9.4 Test requirements
10 Information to be given in the relevant specification
Annex A (normative) Equipment specification
Annex B (informative) Guide to the use of the wetting balance
        for solderability testing
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications
Bibliography

Describes Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.

DevelopmentNote
Supersedes I.S. HD 323.2.54. (09/2006) For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
30
PublisherName
National Standards Authority of Ireland
Status
Withdrawn
SupersededBy

HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 60068-2-44:1995 Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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