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I.S. EN 60749-43:2017

Current
Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2017

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Product categories and applications
5 Failure
6 Reliability test
7 Stress test methods
8 Supplementary tests
9 Summary table of assumptions
10 Summary
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Provides guidelines for reliability qualification plans of semiconductor integrated circuit products (ICs).

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (09/2017)
DocumentType
Standard
Pages
88
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
EN 60749-43:2017 Identical

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60749-28:2017 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
EN 60749-23:2004/A1:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE
EN 60749-15:2010/AC:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
EN 60749-42:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
EN 60749-29:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST
EN 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC Q 01 : 5.0 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - BASIC RULES
EN 60749-21:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
IEC 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-42:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
EN 60749-26:2014 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-23:2004+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
EN 60749-28:2017 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

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