TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2016

Publisher

National Standards Authority of Ireland

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National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test specimens
5 Test apparatus
6 Procedure
7 Report
8 Additional information
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications

Defines a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	36
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
EN 61189-3-719:2016	Identical

IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions

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I.S. EN 61189-3-719:2016

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Abstract

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