MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-12: SECTIONAL SPECIFICATION SET FOR REINFORCED BASE MATERIALS, CLAD AND UNCLAD - EPOXIDE NON-WOVEN ARAMID LAMINATE OF DEFINED FLAMMABILITY, COPPER CLAD

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Hardcopy , PDF

Language(s)

English

Published date

01-01-1999

Publisher

National Standards Authority of Ireland

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Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
7 Non-electrical properties of the base material after
  complete removal of the copper foil
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
        reference numbers
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Covers requirements for properties of epoxide non-woven aramid copper clad laminate of defined flammability, in thicknesses of 0.05 mm up to 6.4 mm.

DevelopmentNote	For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType	Standard
Pages	28
PublisherName	National Standards Authority of Ireland
Status	Current

Standards	Relationship
NF EN 61249-2-12 : 2002	Identical
UNE-EN 61249-2-12:2001	Identical
DIN EN 61249-2-12:1999-11	Identical
EN 61249-2-12:1999	Identical
IEC 61249-2-12:1999	Identical
SN EN 61249-2-12 : 1999	Identical
BS EN 61249-2-12:1999	Identical

EN 61249-5-1:1996	Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61249-5-1:1995	Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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I.S. EN 61249-2-12:1999

Current

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

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