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I.S. EN 61249-3-5:1999

I.S. EN 61249-3-5:1999

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The latest, up-to-date edition.

MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS) - TRANSFER ADHESIVE FILMS

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-1999

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

FOREWORD
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Designation
6 Properties of adhesive films
7 Dimensions and tolerances
8 Packaging and marking
9 Acceptance testing
Annex A (informative) Conversion table for test method
        reference numbers
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Covers requirements for transfer adhesive films for use in the fabrication of flexible multilayer boards or flex-rigid printed boards.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
24
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
BS EN 61249-3-5:1999 Identical
UNE-EN 61249-3-5:2000 Identical
NF EN 61249-3-5 : 2002 Identical
EN 61249-3-5:1999 Identical
IEC 61249-3-5:1999 Identical
DIN EN 61249-3-5:1999-11 Identical
SN EN 61249-3-5 : 1999 Identical

EN 60249-2-15 : 1994 AMD 1 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY
EN 60249-2-8 : 1994 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM
IEC 60249-2-8:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film
EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
EN 60249-2-13 : 1994 AMD 1 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 13: FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE
IEC 60249-2-15:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability
IEC 60249-2-13:1987 Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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