SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2016

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

National Foreword
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Requirements
5 Testing method
Annex A (informative) - Dimensions for testing
        structure and tensile/compressive strength
Annex B (informative) - Pull-press testing method
        example
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS).

DocumentType	Standard
Pages	60
PublisherName	National Standards Authority of Ireland
Status	Current

EN 62047-1:2016	Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
IEC 62047-1:2016	Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
ISO 10012:2003	Measurement management systems — Requirements for measurement processes and measuring equipment
EN ISO 10012:2003	Measurement management systems - Requirements for measurement processes and measuring equipment (ISO 10012:2003)