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I.S. EN 62572-3:2016

Current
Current

The latest, up-to-date edition.

FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION
Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2016

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

National Foreword
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions, symbols and
  abbreviations
4 Laser reliability and quality assurance
  procedure
5 Tests
6 Activities
Annex A (informative) - Guidance on testing
        in Table 1 and Table 2
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Specifies reliability assessment of laser modules used for telecommunication.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
34
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
EN 62572-3:2016 Identical

IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
EN 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
EN 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
EN 60749-26:2014 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC TR 62572-2:2008 Fibre optic active components and devices - Reliability standards - Part 2: Laser module degradation
EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
EN 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

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