International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits

Amended by

IEC 60050-541:1990/AMD1:2015

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English

Published date

10-15-1990

Publisher

International Electrotechnical Committee

Foreword
Preface
541-01 General terms
541-02 Base material
541-03 Conception - Artwork master
541-04 Manufacturing

It has the status of a horizontal standard in accordance with IEC Guide 108.

Committee	TC 1
DocumentType	Standard
Pages	32
PublisherName	International Electrotechnical Committee
Status	Current

I.S. EN 60194:2006	PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
IEC 60139:2000	Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
BS EN 60194:2006	Printed board design, manufacture and assembly. Terms and definitions
CEI EN 60194 : 2009	PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
I.S. EN ISO 10303-210:2002	INDUSTRIAL AUTOMATION SYSTEMS AND INTEGRATION - PRODUCT DATA REPRESENTATION AND EXCHANGE - PART 210: APPLICATION PROTOCOL: ELECTRONIC ASSEMBLY, INTERCONNECTION, AND PACKAGING DESIGN
05/30141770 DC : DRAFT NOV 2005
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
IEC 61747-1:1998+AMD1:2003 CSV	Liquid crystal and solid-state display devices - Part 1: Generic specification
EN ISO 10303-210:2002	Industrial automation systems and integration - Product data representation and exchange - Part 210: Application protocol: Electronic assembly, interconnection, and packaging design (ISO 10303-210:2001)
EN 60194:2006	Printed board design, manufacture and assembly - Terms and definitions
EN 60139:2001	Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges

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IEC 60050-541:1990