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IEC 60191-2U:1997

Current
Current

The latest, up-to-date edition.

Nineteenth supplement
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

05-09-1997

Foreword
Preface
Chapter 00
Philosophy of Mechanical Standardization
Chapter 0
Recommended Values for Certain Dimensions of Drawings of
Semiconductor Devices
Chapter I
Device Outline Drawings
Types of Semiconductor Devices Generally Mounted in the
Packages of Chapter I
Chapter II
Base Drawings
Chapter III
Case Outline Drawings
Chapter IV
Gauge Drawings
Chapter V
Tables Showing Associations Between Case Outlines and Bases
Obsolete Drawings
Additions to the Lists of National Codes Appearing on the Standard
Sheets of IEC Publication 60191-2
Deletions to the Lists of National Sheets of IEC Publication 60191-2NO CONTENTS SECTION

Incorporated into main document IEC 60191 PT2.

DevelopmentNote
This standard is part of the Consolidated edition of IEC 60191 PT2 1966 but can be purchased separately. Stability Date: 2020. (07/2015)
DocumentType
Standard
Pages
11
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
NEN IEC 60191-2U : 1998 Identical

IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

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