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IEC
IEC 60191-3:1999

IEC 60191-3:1999

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, Spanish, Castilian

Published date

10-29-1999

Publisher

International Electrotechnical Committee

Foreword
1 General
2 Terminology and definitions
3 Cross-referencing of packages
4 Terminal identification - Numbering of terminals
5 Dimensions and reference letter symbols
6 Drawing layout
7 Dimensioning and tolerances
8 Inter-conversion of inch and millimetre dimensions,
      and rules for rounding-off
9 Definition of families
10 Examples of drawings
11 Design procedure for dimensions of integrated circuit
      packages
12 Rules for mounting integrated circuit packages into
      carriers
13 Bending of terminals of QUIL packages
14 Pin grid arrays
15 Rule for orientation of integrated circuit packages in
      handling and shipping carriers such as stick magazines
      and rails
Annex A (normative) Limits applicable for the dimensions of
                    integrated circuit package outlines
Annex B (informative) Example drawings showing cross-
                      referencing of packages, utilization
                      of reference letter symbols, terminal
                      identification and index area
Annex C (normative) Terminal identification and numbering of
                    terminals of devices with terminals
                    disposed in three or more rows in each
                    orthogonal direction
Annex D (normative) Recommended dimensions of integrated
                    circuit packages of Form G family
Annex E (normative) General rules for the preparation of
                    outline drawings of packages of Form G
                    intended for automated handling
Annex F (normative) General rules for the preparation of
                    outline drawings of pin grid arrays
Annex G (normative) Rule for orientation of integrated
                    circuit packages in handling and shipping
                    carriers such as stick magazines and rails
Annex G (normative) Rule for orientation of integrated circuit
                    packages in handling and shipping carriers
                    such as stick magazines and rails
Annex H (normative) Bottom view method for Terminal No 1
                    recognition
Annex K (normative) Gate burrs, mold flash and protrusions

Gives guidance on the preparation of drawings of integrated circuits outlines.

Committee
TC 47/SC 47D
DevelopmentNote
Also numbered as BS EN 60191-3. (09/2005) Stability Date: 2018. (09/2017)
DocumentType
Standard
Pages
113
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

Standards Relationship
NF EN 60191-3 : 2000 Identical
UNE-EN 60191-3:2001 Identical
NEN 10191-3 : 91 AMD 2 97 Identical
NEN EN IEC 60191-3 : 2000 Identical
I.S. EN 60191-3:2000 Identical
PN EN 60191-3 : 2002 Identical
SN EN 60191-3 : 1999 Identical
AS 3708.3-1989 Identical
CEI 47-7 : 1ED 1981 Identical
EN 60191-3:1999 Identical

BS IEC 62679-1-1:2014 Electronic paper displays Terminology
BS EN 61666:2010 Industrial systems, installations and equipment and industrial products. Identification of terminals within a system
I.S. EN 60191-6:2009 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
EN 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
BS CECC 90000:1985 Harmonized system of quality assessment for electronic components. Generic specification: monolithic integrated circuits
I.S. EN 61666:2010 INDUSTRIAL SYSTEMS, INSTALLATIONS AND EQUIPMENT AND INDUSTRIAL PRODUCTS - IDENTIFICATION OF TERMINALS WITHIN A SYSTEM
BS EN 60191-6:2009 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS IEC 61747-1 : 1998 AMD 10788 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - GENERIC SPECIFICATION
08/30179080 DC : DRAFT OCT 2008 BS EN 61666 - INDUSTRIAL SYSTEMS, INSTALLATIONS AND EQUIPMENT AND INDUSTRIAL PRODUCTS - IDENTIFICATION OF TERMINALS WITHIN A SYSTEM
CEI EN 61747-1 : 2004 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION
IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
BS CECC 63000:1990 Harmonized system of quality assessment for electronic components. Generic specification: film and hybrid integrated circuits
BS CECC 64000:1990 Harmonized system of quality assessment for electronic components: generic specification: film resistor networks
BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
05/30132036 DC : DRAFT APR 2005 IEC 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TEST AND BURN-IN SOCKET FOR BGA, LGA, FBGA AND FLGA
IEC 62679-1-1:2014 Electronic paper displays - Part 1-1: Terminology
I.S. EN 60191-6-16:2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
IEC 60747-10:1991 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
IEC 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
CEI EN 61666 : 2011 INDUSTRIELLE SYSTEME, ANLAGEN UND AUSRUESTUNGEN UND INDUSTRIEPRODUKTE - IDENTIFIKATION VON ANSCHLUESSEN IN SYSTEMEN
12/30244653 DC : 0 BS EN 62679-1 - ELECTRONIC PAPER DISPLAY - PART 1:TERMINOLOGY AND GENERIC SPECIFICATION
05/30132033 DC : DRAFT APR 2005 IEC 60191-6-13 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP TYPE SOCKET FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA)
BS EN 60191-6-16:2007 Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
DEFSTAN 59-62(PT5)/1(1983) : 1983 MICROCIRCUITS ELECTRONIC (INTEGRATED CIRCUITS) - PART 5: ANALOGUE SWITCH/MULTIPLEXERS
BS EN 61747-1:2000 Liquid crystal and solid-state display devices Generic specification
BS EN 60286-4:2013 Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms
CEI EN 60286-4 : 2014 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS
I.S. EN 60286-4:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV))
CEI EN 60191-6 : 2011 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 61666:2010 Industrial systems, installations and equipment and industrial products - Identification of terminals within a system
IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
13/30284029 DC : 0 BS EN 60191-6-16 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
CEI EN 60191-6-16 : 2008 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
BS 3934-6:1992 Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages
07/30167960 DC : 0 BS EN 60191-6 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES
EN 61666:2010 Industrial systems, installations and equipment and industrial products - Identification of terminals within a system
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
EN 61747-1:1999/A1:2003 LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES - PART 1: GENERIC SPECIFICATION

IEC 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
ISO 2692:2014 Geometrical product specifications (GPS) Geometrical tolerancing Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR)
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
Hardcopy - Spanish
PDF - Spanish
PDF 3 Users - Spanish
PDF 5 Users - Spanish
PDF 9 Users - Spanish
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