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IEC 60326-9:1991

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

12-31-2021

Language(s)

English - French

Published date

03-19-1991

Publisher

International Electrotechnical Committee

FOREWORD
PREFACE
Clause
1. Scope
2. Normative references
3. General
4. Test specimens
5. Relevant specification
6. Characteristics of printed boards
7. Test pattern - Test boards
Figures

Relates to flexible multilayer printed boards with through connections irrespective of their method of manufacture. Intended as a basis on which agreements between purchaser and vendor can be made. Defines the characteristics to be assessed, the test methods to be used, and establishes uniform requirements for judging properties and dimensions.Not applicable to flat cables.

DevelopmentNote
Also numbered as BS 6221-9(1991) (09/2005)
DocumentType
Standard
Pages
63
PublisherName
International Electrotechnical Committee
Status
Withdrawn

Standards Relationship
DIN IEC 60326-9:1993-04 Identical
SAC GB/T 18334 : 2001 Identical
NEN 10326-9 : 1991 Identical

IEC 60326-12:1992 Printed boards - Part 12: Specification for mass lamination panels (semi-manufactured multilayer printed boards)
BS EN 123800:1997 Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections
IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
EN 123800:1996 Sectional Specification: Flexible multilayer printed boards with through connections

IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60326-3:1991 Printed boards - Part 3: Design and use of printed boards

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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