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IEC 60454-3-1:1998+AMD1:2001 CSV

Current
Current

The latest, up-to-date edition.

Pressure-sensitive adhesive tapes for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: PVC film tapes with pressure-sensitive adhesive
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

12-19-2002

FOREWORD
INTRODUCTION
1 General
2 Classification and designation
3 Prescriptions
3 Requirements
4 Test methods
5 Marking, labelling, and packaging
Tables

Contains the requirements for plasticized PVC film tapes with pressure-sensitive adhesive for products having thermal indices from 60 to 105 and minimum temperature ratings from 0°C to -33°C. This consolidated version consists of the second edition (1998) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.

Committee
TC 15
DevelopmentNote
Also numbered as BS EN 60454-3.1 (07/2002) Stability Date: 2023. (09/2017)
DocumentType
Standard
Pages
15
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

I.S. EN 60664-3:2017 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
IEC 60664-3:2016 RLV Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
EN 60664-3:2017 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
16/30336979 DC : 0 BS EN 60664-3 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
I.S. EN 61189-3:2008 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
UNE-EN 60664-3:2004 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
BS 6221-2:1991 Printed wiring boards Methods of test
IEC 60664-3 REDLINE : 3ED 2016 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
09/30201707 DC : 0 BS EN 60664-3+A1 ED.2 - INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
BS EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
NF EN 60664-3 : 2017 INSULATION COORDINATION FOR EQUIPMENT WITHIN LOW-VOLTAGE SYSTEMS - PART 3: USE OF COATING, POTTING OR MOULDING FOR PROTECTION AGAINST POLLUTION
BS EN 60664-3:2017 Insulation coordination for equipment within low-voltage systems Use of coating, potting or moulding for protection against pollution
IEC 60664-3:2016 Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution
EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

IEC 60454-2:2007 Pressure-sensitive adhesive tapes for electrical purposes - Part 2: Methods of test
IEC 60454-1:1992 Specifications for pressure-sensitive adhesive tapes for electrical purposes - Part 1: General requirements
IEC 60426:2007 Electrical insulating materials - Determination of electrolytic corrosion caused by insulating materials - Test methods

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