Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, Spanish, Castilian

Published date

01-24-2001

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope and object
2 Normative references
3 Preparation of the specimen
4 Procedure
4.1 Accelerated ageing
4.2 Flux
5 Final measurement
6 Requirements
7 Details to be specified

Defines a standard test method to assess the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.

Committee	TC 48/SC 48B
DevelopmentNote	Also numbered as BS EN 60512-12-7. (08/2001) Stability Date: 2017. (10/2012)
DocumentType	Standard
Pages	7
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
I.S. EN 60512-12-7:2001	Identical
NF EN 60512-12-7 : 2002	Identical
CEI EN 60512-12-7 : 2002	Identical
PN EN 60512-12-7 : 2002	Identical
DIN EN 60512-12-7:2001-11	Identical
NEN EN IEC 60512-12-7 : 2001	Identical
SN EN 60512-12-7 : 2001	Identical
UNE-EN 60512-12-7:2002	Identical
JIS C 5402-12-7:2005	Identical

IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-54:2006	Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

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IEC 60512-12-7:2001

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Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

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