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IEC 60749-3:2017

Current
Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, English

Published date

03-03-2017

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - External visual report
        form/checklist (example only - not a
        mandatory template)
Bibliography

IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.

Committee
TC 47
DevelopmentNote
Supersedes IEC PAS 62163 (08/2002) Supersedes IEC 60749. (03/2008) Stability Date: 2022. (03/2017)
DocumentType
Standard
ISBN
978-2-8322-7318-0
Pages
21
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

13/30264591 DC : 0 BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
I.S. EN 60749-34:2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
BS EN 60749-34:2010 Semiconductor devices. Mechanical and climatic test methods Power cycling
IEC 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
NF EN 60749-20 : 2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
EN 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
02/207672 DC : DRAFT JULY 2002 IEC 60749-34 ED.1 - POWER CYCLING
I.S. EN 62435-5:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
I.S. EN 60749-11:2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 11: RAPID CHANGE OF TEMPERATURE - TWO-FLUID-BATH METHOD
09/30209939 DC : 0 BS EN 60749-34 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
CEI EN 60749-34 : 2012 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
BS EN 60749-11:2002 Semiconductor devices. Mechanical and climatic test methods Rapid change of temperature. Two-fluid-bath method
07/30168484 DC : 0 BS EN 60749-20 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
CEI EN 60749-20 : 2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
BS EN 60749-20:2009 Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
UNE-EN 60749-34:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
BS EN 62435-5:2017 Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices
PD IEC/TS 62686-1:2015 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
CEI EN 60749-11 : 2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 11: RAPID CHANGE OF TEMPERATURE - TWO-FLUID-BATH METHOD
13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
I.S. EN 60749-20:2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
EN 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC 62483:2013 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

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