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IEC 60749-4:2017

Current
Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, English

Published date

03-03-2017

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 HAST test - General remarks
5 Test apparatus
6 Test conditions
7 Procedure
8 Failure criteria
9 Safety
10 Summary

IEC 60749-4:2017 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments. This edition includes the following significant technical changes with respect to the previous edition:
a) clarification of requirements for temperature, relative humidity and duration detailed in Table 1;
b) recommendations that current limiting resistor(s) be placed in the test set-up to prevent test board or DUT damage;
c) allowance of additional time-to-test delay or return-to-stress delay.

Committee
TC 47
DevelopmentNote
Supersedes IEC PAS 62177 (08/2002) Supersedes IEC 60749. (03/2008) Stability Date: 2022. (03/2017)
DocumentType
Standard
Pages
20
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

BS EN 60749-5:2017 Semiconductor devices. Mechanical and climatic test methods Steady-state temperature humidity bias life test
13/30264591 DC : 0 BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
BS EN 60749-30 : 2005 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
EN 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
NF EN 60749-30 : 2005 AMD 1 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
CEI EN 60749-5 : 2005 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
NF EN 60749-5 : 2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
EN 60749-30 : 2005 AMD 1 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
I.S. EN 60749-30:2005 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
I.S. EN 60749-5:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST (IEC 60749-5:2017)
PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
PD IEC/TS 62686-1:2015 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
IEC 60749-30:2005+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

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