Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French, Spanish, Castilian

Published date

02-27-2003

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Materials and construction
   3.1 Resin system
   3.2 Reinforcement
   3.3 Metal foil
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad laminate
   6.1 Appearance of the copper-clad sheet
   6.2 Appearance of the unclad face
   6.3 Laminate thickness
   6.4 Bow and twist
   6.5 Properties related to the copper foil bond
   6.6 Punching and machining
   6.7 Dimensional stability
   6.8 Sheet sizes
   6.9 Cut panels
7 Non-electrical properties of the base material after
   complete removal of the copper foil
   7.1 Appearance of the dielectric base material
   7.2 Flexural strength
   7.3 Flammability
   7.4 Water absorption
   7.5 Measling
   7.6 Glass transition temperature and cure factor
8 Quality assurance
   8.1 Quality system
   8.2 Responsibility for inspection
   8.3 Qualification inspection
   8.4 Quality conformance inspection
   8.5 Certificate of conformance
   8.6 Safety data sheet
9 Packaging and marking
10 Ordering information
Annex A (informative) Engineering information
Annex B (informative) Common laminate constructions
Annex C (informative) Guideline for qualification and
        conformance inspection
Bibliography
Tables

Gives requirements for properties of bismaleimide/triazine modified epoxide, or unmodified, woven E-glass reinforced laminate sheets of defined flammability, copper-clad in thicknesses of 0,05 mm to 3,2 mm. The flammability rating is achieved through the use of fire retardants contained as an integral part of the epoxide polymeric structure.

Committee	TC 91
DevelopmentNote	Stability Date: 2018. (09/2017)
DocumentType	Standard
Pages	45
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NF EN 61249-2-9 : 2004	Identical
NEN EN IEC 61249-2-9 : 2003	Identical
UNE-EN 61249-2-9:2004	Identical
I.S. EN 61249-2-9:2003	Identical
PN EN 61249-2-9 : 2004	Identical
SN EN 61249-2-9 : 2003	Identical
BS EN 61249-2-9:2003	Identical
CEI EN 61249-2-9 : 2004	Identical
EN 61249-2-9:2003	Identical
DIN EN 61249-2-9:2004-01	Identical

BS EN 62326-4:1997	Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
BS EN 62326-4-1:1997	Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C

ISO 11014-1:1994	Safety data sheet for chemical products Part 1: Content and order of sections
IEC 61249-5-1:1995	Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
ISO 14001:2015	Environmental management systems — Requirements with guidance for use
IEC 60194:2015	Printed board design, manufacture and assembly - Terms and definitions
ISO 9000:2015	Quality management systems — Fundamentals and vocabulary
IEC 61189-2:2006	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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IEC 61249-2-9:2003

Current

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Abstract

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