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IEC 62137-3:2011

IEC 62137-3:2011

Current

Current

The latest, up-to-date edition.

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

11-08-2011

Publisher

International Electrotechnical Committee

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Procedure of selecting the applicable test method
6 Common subjects in each test method
7 Evaluation test method
Annex A (informative) - Condition of rapid temperature
        change
Annex B (informative) - Electrical continuity test for
        solder joint
Annex C (informative) - Torque shear strength test
Annex D (informative) - Monotonic bending strength test
Annex E (informative) - Cyclic steel ball drop strength test
Annex F (informative) - Pull strength test
Annex G (informative) - Creep strength test
Annex H (informative) - Evaluation method for the fillet lifting
        phenomenon of a lead insertion type device solder joint
Bibliography

IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.

Committee
TC 91
DevelopmentNote
Supersedes IEC PAS 62137-3. (11/2011) Stability Date: 2022. (11/2017)
DocumentType
Standard
Pages
90
PublisherName
International Electrotechnical Committee
Status
Current
Supersedes

Standards Relationship
JIS C 62137-3:2014 Identical
NF EN 62137-3 : 2012 Identical
NEN EN IEC 62137-3 : 2012 Identical
I.S. EN 62137-3:2012 Identical
PN EN 62137-3 : 2012 Identical
UNE-EN 62137-3:2012 Identical
BS EN 62137-3:2012 Identical
CEI EN 62137-3 : 2012 Identical
EN 62137-3:2012 Identical
DIN EN 62137-3:2012-08 Identical

BS EN 62137-4:2014 Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices
EN 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
IEC TS 62647-3:2014 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
NF EN 62137-4 : 2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
CEI EN 60068-3-13 : 1ED 2017 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
IEC 62137-4:2014 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
BS EN 60068-3-13:2016 Environmental testing Supporting documentation and guidance on Test T. Soldering
I.S. EN 60068-3-13:2016 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
IEC 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
PD IEC/TS 62647-3:2014 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Performance testing for systems containing lead-free solder and finishes
12/30271778 DC : 0 BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
I.S. EN 62137-4:2014 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
EN 62137-4:2014/AC:2015 ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014)

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
IEC 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
IEC 62137:2004 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
IEC 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

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Hardcopy - English - French
PDF - English - French
PDF 3 Users - English - French
PDF 5 Users - English - French
PDF 9 Users - English - French
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