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IEC PAS 62137-3:2008

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

11-08-2011

Language(s)

English

Published date

11-13-2008

Publisher

International Electrotechnical Committee

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Procedure of selecting the applicable test method
  4.1 Stress to solder joints in the field and test methods
  4.2 Selection of test methods based on the shapes and
      terminals of electronic components
5 Common subjects in each test method
  5.1 Mounting device and materials used
  5.2 Soldering condition
  5.3 Accelerated endurance test
  5.4 Selection of test conditions and analysis of test
      results
6 Test method
  6.1 Body strength test of SMD before and after the rapid
      temperature change test
  6.2 Cyclic bending strength test
  6.3 Mechanical shear fatigue test
  6.4 Cyclic drop test
  6.5 Strength test of leaded component
  6.6 Fillet lifting phenomenon observation of leaded
      component
Annex A (informative) Condition of rapid temperature
        change test
Annex B (informative) Soldered joint test by electrical
        conduction
Annex C (informative) Torque shear strength test
Annex D (informative) Monotonic bending strength test
Annex E (informative) Cyclic steel ball drop strength test
Annex F (informative) Pull strength test
Annex G (informative) Creep strength test
Annex H (informative) Fillet lifting phenomenon observation
        of leaded component solder joint and the life test
        by electrical conduction

IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.

DocumentType
Miscellaneous Product
Pages
41
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
NEN NPR IEC/PAS 62137-3 : 2008 Identical
DD IEC PAS 62137-3 : DRAFT 2008 Identical

11/30252855 DC : 0 BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
IEC 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
IEC 62137:2004 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
IEC 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

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Hardcopy - English
PDF - English
PDF 3 Users - English
PDF 5 Users - English
PDF 9 Users - English
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