• There are no items in your cart

IEC PAS 62647-21:2011

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

07-26-2013

Language(s)

English

Published date

07-28-2011

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Symbols and abbreviated terms
5 General discussion of program management/systems
   engineering management concerns
6 Requirements definition
7 Use environment(s)
8 Decision criteria
9 Suppliers lead-free control plan
10 Requalification/test plan
11 Rework/repair and maintenance
12 Risk management
13 Cost
14 Presentation to customer
Annex A (informative) - Matrix of tier level versus
                        associated risk
Annex B (informative) - Links to the European Union
                        Directives and Executive
                        Order 13148
Annex C (informative) - General program manager checklist
                        for dealing with Pb-free issues
Annex D (informative) - General manufacturing process
                        assessment checklist for assessing
                        supplier compliance to IEC/PAS 62647-1
                        (GEIA-STD-0005-1)
Annex E (informative) - Recommended program language
                        (subject to contractual agreements)
Bibliography

IEC/PAS 62647-21:2011(E) is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and performance.

This publication is to be read in conjunction with IEC/PAS 62647-1:2011 and IEC/PAS 62647-2:2011.

DevelopmentNote
Stability Date: 2014. (10/2012)
DocumentType
Miscellaneous Product
Pages
34
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IEC PAS 62647-3:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
PD IEC/TS 62647-2:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin
IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
DD IEC PAS 62647-3 : DRAFT SEP 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES

IEC PAS 62647-2:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin
GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
ASQ Q9000:2005 Quality Management Systems - Fundamentals And Vocabulary
IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR

View more information
US$273.00
Excluding Tax where applicable

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.