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IEC TR 61189-3-914:2017

Current

Current

The latest, up-to-date edition.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English

Published date

03-17-2017

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Test condition
5 Pre-condition
6 Heat dissipation characteristics
Annex A (informative) - Classification and class of
        the PCB
Annex B (informative) - Measurement comparison
        between companies (plane)

IEC TR 61189-3-914:2017(E) specifies the detailed procedures and precautions for IEC 61189-3-913.

DevelopmentNote
Stability Date: 2022. (03/2017)
DocumentType
Technical Report
Pages
24
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
PD IEC/TR 61189-3-914:2017 Identical

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 61189-3-913:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions

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