Name: IPC 1902 : 1998
Brand: IPC

IPC 1902 : 1998

Withdrawn

GRID SYSTEMS FOR PRINTED CIRCUITS

Withdrawn date

07-23-2013

Published date

01-12-2013

Publisher

Institute of Printed Circuits

Confirms compatibility between printed circuits and components to be mounted on them at grid intersections. Contains discussion of the requirements for development of specialized modular grids in order to allow flexibility in future designs.

DevelopmentNote	Also available in CD-ROM format. (09/2005) Inactive for new design. (07/2008)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Withdrawn

Standards	Relationship
IEC 60097:1991	Identical

IPC 7351 GERMAN : B	Basic requirements for SMT design and SMD patch guideline
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

IPC S 816 : 0	SMT PROCESS GUIDELINE AND CHECKLIST
IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC SM 780 : 0	COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING
IPC S 100 : LATEST	STANDARDS AND SPECIFICATIONS MANUAL
IPC E 500 : LATEST	IPC ELECTRONIC DOCUMENT COLLECTION
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC M 105 : LATEST	RIGID PRINTED BOARD MANUAL
IPC TA 723 : 1991	TECHNOLOGY ASSESSMENT HANDBOOK ON SURFACE MOUNTING
IPC SM 782 : A1993 AMD 2 1999	SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD