IPC 2224 : 0

Name: IPC 2224 : 0
Brand: IPC

Withdrawn

SECTIONAL STANDARD FOR DESIGN OF PWBS FOR PC CARDS

Withdrawn date

05-22-2016

Publisher

Institute of Printed Circuits

1.0 SCOPE
     1.1 Purpose
     1.2 Documentation Hierarchy
     1.3 Presentation
     1.4 Interpretation
     1.5 Classification of Products
2.0 APPLICABLE DOCUMENTS
     2.1 Reference Documents
3.0 GENERAL REQUIREMENTS
     3.1 Test Requirement Considerations
4.0 MATERIALS
     4.1 Material Selection
     4.2 Bonding Material
     4.3 Laminate Materials
     4.4 Flexible Substrates
     4.5 Conductive Materials
     4.6 Organic Protective Coatings
     4.7 Marking and Legends
     4.8 Thickness Class Tolerance
5.0 MECHANICAL/PHYSICAL PROPERTIES
     5.1 Fabrication Requirements
     5.2 Product/Board Configuration
     5.3 Assembly Requirements
     5.4 Dimensioning Systems
     5.5 Structural Strength
6.0 ELECTRICAL PROPERTIES
7.0 THERMAL MANAGEMENT
     7.1 Convection
     7.2 Heat Dissipation Considerations
8.0 COMPONENT AND ASSEMBLY ISSUES
     8.1 General Placement Requirements
     8.2 Plated-Through Hole Requirements
     8.3 Mounting Methods for Connectors
     8.4 Stiffeners
     8.5 Fine Pitch SMT (Peripherals)
     8.6 Array SMT (BGA, ?BGA, etc.)
     8.7 Bare Die
     8.8 Tape Automated Bonding
     8.9 Castellations
     8.10 Bottom Only Terminations
9.0 HOLES/INTERCONNECTIONS
     9.1 General Requirements for Lands with Holes
     9.2 Holes
     9.3 Drill Size Recommendations for Printed
          Boards
10.0 GENERAL CIRCUIT FEATURE REQUIREMENTS
     10.1 Conductor Characteristics
     10.2 Land Characteristics
11.0 DOCUMENTATION
     11.1 Artwork
12.0 QUALITY ASSURANCE
Figures
Tables

Establishes the requirements for the design of printed boards for PC card form factors. The organic materials may be reinforced, homogeneous, or used in combination with inorganic materials; interconnections may be single, double or multilayered.

DevelopmentNote	To be used in conjunction with IPC 2221. (06/2002) Included in IPC 2220 Series. Also available in CD-ROM format. (09/2005)
DocumentType	Standard
PublisherName	Institute of Printed Circuits
Status	Withdrawn

ASME Y14.24 : 2012

TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES

IPC A 600 : H	ACCEPTABILITY OF PRINTED BOARDS
IPC 2220 : LATEST	IPC 2220 FAMILY OF DESIGN DOCUMENTS
IPC 2141 : A	DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
IPC CM 770 : E	COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS
IPC S 100 : LATEST	STANDARDS AND SPECIFICATIONS MANUAL
IPC 4101 : D	SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
IPC 2221B:2012	GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2222 : A	SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS
IPC M 106 : LATEST	TECHNOLOGY REFERENCE FOR DESIGN MANUAL
IPC D 317 : A1995	DESIGN GUIDELINES FOR ELECTRONIC PACKAGING UTILIZING HIGH SPEED TECHNIQUES
IPC D 316 : 1995	HIGH FREQUENCY DESIGN GUIDE
IPC SM 782 : A1993 AMD 2 1999	SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD