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IPC 7094 : 0

Superseded
Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS
Available format(s)

Hardcopy

Superseded date

09-13-2023

Language(s)

English

Published date

02-14-2018

Publisher

Institute of Printed Circuits

1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS AND TECHNOLOGY OVERVIEW
4 FLIP CHIP TECHNOLOGY
5 FLIP CHIP POST FABRICATION PROCESSING
6 FLIP CHIP INTERCONNECTING SUBSTRATES
7 PACKAGE LEVEL STANDARDIZATION
8 SYSTEM LEVEL ISSUES
9 FLIP CHIP AND DIE SIZE DEVICE ASSEMBLY
10 REQUIREMENTS FOR BOARD AND MODULE
   LEVEL RELIABILITY
11 RELIABILITY PREDICTION MODELING
12 VALIDATION AND QUALIFICATION TESTING
13 SUPPLY CHAIN ISSUES
APPENDIX A - Glossary
APPENDIX B - Acronyms

Specifies the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly.

Committee
5-20
DevelopmentNote
Supersedes J STD 012. (01/2015) Included in the IPC C 1000 Collection. (05/2016)
DocumentType
Standard
Pages
92
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES

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