IPC 7801 : 0

Superseded

View Superseded by

REFLOW OVEN PROCESS CONTROL STANDARD

Available format(s)

Hardcopy

Superseded date

10-14-2022

Language(s)

English

Publisher

Institute of Printed Circuits

1 GENERAL
2 APPLICABLE DOCUMENTS
3 TERMS AND DEFINITIONS
4 THERMAL PROFILES - snpb AND Pb-FREE
5 GOLDEN BOARD DESIGN FOR PROCESS
   VERIFICATIONS
6 PROFILING EQUIPMENT REQUIREMENTS
7 THERMOCOUPLES
8 VERIFICATION PROFILING FREQUENCY
9 REQUIREMENTS FOR OVEN REPEATABILITY
   CALCULATIONS
10 MAINTENANCE AND CALIBRATION
   GUIDELINES

Gives process control for solder reflow ovens by baseline and periodic verifications of oven profiles using a standard methodology.

DevelopmentNote	Included in IPC C 103 & IPC C 1000. (05/2016) Also available in Hardcopy format. (01/2018)
DocumentType	Standard
Pages	28
PublisherName	Institute of Printed Circuits
Status	Superseded
SupersededBy	IPC 7801 : 2015

IPC T 50 : M	TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC J STD 033C-1:2014	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IPC 7351 : B	GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC 7530 : 0	GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE)
IPC 1601 : 0	PRINTED BOARD HANDLING AND STORAGE GUIDELINES
IPC 9194 : 0	IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC) APPLIED TO PRINTED BOARD ASSEMBLY MANUFACTURE GUIDELINE
IPC J STD 075 : 0	CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES