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IPC 9707 : 0

Current
Current

The latest, up-to-date edition.

SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS
Available format(s)

Hardcopy

Language(s)

English

Published date

05-01-2018

Publisher

Institute of Printed Circuits

FOREWORD
INTRODUCTION
1 SCOPE
2 APPLICABLE DOCUMENTS
3 TERMS AND DEFINITIONS
4 SAMPLE SIZE
5 APPARATUS AND SETUP
6 TEST VEHICLES
7 TEST PROCEDURE
8 FAILURE CRITERIA AND ANALYSIS
ANNEX A (INFORMATIVE) - FAILURE ANALYSIS TECHNIQUES

Qualifies the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading.

DevelopmentNote
Included in IPC C 103 & IPC C 1000. Jointly published by IPC and JEDEC. (09/2011)
DocumentType
Standard
Pages
7
PublisherName
Institute of Printed Circuits
Status
Current

IPC 9704 CHINESE : - PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE
IPC 9709 : 0 TEST GUIDELINES FOR ACOUSTIC EMISSION MEASUREMENT DURING MECHANICAL TESTING
IPC 9704 : A PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE

IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 9704 : A PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE
IPC 9703 : 0 IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY
IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
IPC TM 650 : 0 TEST METHODS MANUAL
IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC 9702 : 0 MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS

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