IPC S 816 : 0
Current
The latest, up-to-date edition.
SMT PROCESS GUIDELINE AND CHECKLIST
07-01-1993
1.0 SCOPE
1.1 Environmental, Safety, and Industrial
Hygiene Considerations
1.2 Applicable Documents
2.0 HANDLING
2.1 Electrostatic Discharge (ESD) Concerns
2.2 Component Leads
2.3 Storage
2.4 Interim Handling
3.0 INCOMING INSPECTION OF MATERIALS AND COMPONENTS
4.0 ADHESIVE APPLICATION
4.1 Dispensing
5.0 SOLDER PASTE APPLICATION
5.1 Stencil Printing
5.2 Screen Printing
5.3 Syringe Dispensing
6.0 COMPONENT PLACEMENT
6.1 Observed Condition: Wrong Component
Orientation
6.2 Observed Condition: Wrong component placed on
board
6.3 Observed Condition: Missing Component
6.4 Observed Condition: Component Misalignment
6.5 Observed Condition: Damaged Component
7.0 INFRARED/CONVECTION REFLOW SOLDERING
7.1 Observed Condition: No Reflow
7.2 Observed Condition: Solder Balls
7.3 Observed Condition: Charring of
Board/Components
7.4 Observed Condition: Damaged Components
7.5 Observed Condition: Cracked Joints
7.6 Observed Condition: Insufficient Solder
7.7 Observed Condition: Bridging
7.8 Observed Condition: Voids
7.9 Observed Condition: Opens
7.10 Observed Condition: Spatter
7.11 Observed Condition: Component Alignment
7.12 Observed Condition: Delamination
7.13 Observed Condition: Warp
7.14 Observed Condition: Disturbed Joints
7.15 Observed Condition: Dewetting
8.0 VAPOR PHASE REFLOW SOLDERING
8.1 General
8.2 Problems
9.0 WAVE SOLDERING
9.1 Observed Condition: Solder Skips
9.2 Observed Condition: Solder Bridges
9.3 Observed Condition: Unfilled Via Holes
9.4 Observed Condition: Solder Wave Overflooding
Board
9.5 Observed Condition: Grainy or Disturbed Joints
9.6 Observed Condition: Cold Joints
9.7 Observed Condition: Solder Balls on Assembly
9.8 Observed Condition: Cracked Chip Components or
Plastic-Bodied Leaded Components
10.0 CLEANING
10.1 Observed Condition: Visible Residue
10.2 Observed Condition: Failure of Conformal
Coating
11.0 REPAIR/REWORK
11.1 Scope
11.2 General
11.3 Goals and Guidelines
11.4 Primary Heating Methods
11.5 Preheating and Auxiliary Heating
11.6 Vision Systems and Component Placement
11.7 Selecting Optimum Method of Rework/Repair
11.8 Troubleshooting
11.9 Observed Condition: Insufficient solder
reflow to affect SMD removal
11.10 Observed Condition: Component not
removable after solder reflow or lifted lands
upon attempted removal
11.11 Observed Condition: Lands being lifted or
damaged during removal of old solder
11.12 Observed Condition: Insufficient or poor
adhesion of solder on lands during
pretinning operation
11.13 Observed Condition: Misalignment of component
to land pattern during SMD installation
11.14 Observed Condition: Dispersion or solderballing
of solder paste during reflow
11.15 Observed Condition: Blistering or measling
of substrate, or lifted lands during SMD
installation or removal
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