IPC J STD 002 : D
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
Hardcopy
08-23-2019
English
06-24-2013
1 PREFACE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS
4 TEST PROCEDURES
5 NOTES
APPENDIX A - Critical Component Surfaces
APPENDIX B - Evaluation Aids
APPENDIX C - Calculation of Maximum
Theoretical Force
APPENDIX D - Calculation of Integrated Value
of Area of the Wetting Curve
APPENDIX E - Informative Annex
APPENDIX F - J-STD-002/J-STD-003 Activated
Solderability Test Flux Rationale
Committee Letter
APPENDIX G - Graphical Representations:
Progression of Solder Wetting
Curve Parameters As Measured
By Wetting Balance Testing
APPENDIX H - Test Protocol for Wetting
Describes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs.
Committee |
5-20
|
DevelopmentNote |
Supersedes IPC S 805, EIA IS 49 & EIA 638. Included in IPC C 103 & IPC C 1000. Supersedes EIA 364-52. (07/2009) Also available in Chinese Language, See separate record J STD 002 CHINESE. (05/2016) Jointly Published by IPC, EIA and JEDEC. (07/2013) Supersedes EIA JESD 22-B102. (03/2016) Also available in Hardcopy format. (03/2018)
|
DocumentType |
Standard
|
Pages |
64
|
PublisherName |
Institute of Printed Circuits
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
DSCC 06012 : A | RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (2.0 WATT), STYLE 2816 |
DSCC 04006 : A | CAPACITORS, TANTALUM, HYBRID, HERMETICALLY SEALED |
MIL-PRF-32535 Revision A:2017 | Capacitor, Chip, Fixed, Ceramic Dielectric (Temperature Stable and General Purpose), Extended Range, High Reliability and Standard Reliability, General Specification for |
ASTM B 965 : 2009 | Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability |
DSCC 06011 : C | RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (1.0 WATT), STYLE 2512 |
IEC 60810:2017 | Lamps, light sources and LED packages for road vehicles - Performance requirements |
I.S. EN 61191-2:2017 | PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
PD IEC/TS 62861:2017 | Guidelines for principal component reliability testing for LED light sources and LED luminaires |
BS EN 61191-3:2017 | Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
14/30309696 DC : 0 | BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
EN 60810 : 2018 | LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
EN 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
MIL-DTL-83731 Revision E:2016 | SWITCHES, TOGGLE, UNSEALED AND SEALED, GENERAL SPECIFICATION FOR |
IPC TR 461 : 1979 | SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS |
IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
IPC J STD 001 SWEDISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 DANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL-STD-202-208 Base Document:2015 | METHOD 208, SOLDERABILITY |
IPC J STD 003 CHINESE : B | SOLDERABILITY TESTS FOR PRINTED BOARDS |
IPC J STD 001 RUSSIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 SPANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC SPVC-LAT1 : 2010 | ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA |
IPC WHMA A 620 HUNGARIAN : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC J STD 001 TURKISH : E2010 | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 POLISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 ROMANIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC TA 722 : 1990 | TECHNOLOGY ASSESSMENT HANDBOOK ON SOLDERING |
IPC WHMA A 620 HEBREW : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC A 610 CZECH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 7093 CHINESE : - | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
IPC A 610 GERMAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 9592 : B | REQUIREMENTS FOR POWER CONVERSION DEVICES FOR THE COMPUTER AND TELECOMMUNICATIONS INDUSTRIES |
IPC TR 465 1 : 1993 | ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY |
IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 POLISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 SPANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC WHMA A 620 CHINESE : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC TR 462 : 0 | SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE |
IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 VIETNAMESE : B2012 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC CH 65 : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
IPC SPVC2005-CD : 2005 | ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER |
IPC CH 65 CHINESE : B | GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
IPC A 610 ITALIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC TR 466 : 1995 | TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST |
IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL STD 750-2 : A | MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999 |
MIL-PRF-8805 Revision G:2016 | SWITCHES AND SWITCH ASSEMBLIES, SENSITIVE, SNAP ACTION (BASIC, LIMIT, PUSH BUTTON AND TOGGLE SWITCHES), GENERAL SPECIFICATION FOR |
IPC J STD 001 HUNGARIAN : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 GERMAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 SWEDISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC HDBK 005 : 0 | GUIDE TO SOLDER PASTE ASSESSMENT |
IPC J STD 075 GERMAN : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
MIL-PRF-83446-36 Revision B:2012 | COILS, RADIO FREQUENCY, CHIP, OPEN CONSTRUCTION, SURFACE MOUNT, 0603 SIZE |
IPC A 610 HUNGARIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 POLISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
MIL-DTL-3950 Revision K:2016 | Switches, Toggle, Environmentally Sealed, General Specification for |
IPC 7351 GERMAN : B | Basic requirements for SMT design and SMD patch guideline |
IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
IPC A 610 JAPANESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 075 CHINESE : - | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
IPC J STD 001 DANISH : E | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC TR 465 3 : - | EVALUATION OF STEAM AGING ON ALTERNATIVE FINISHES, PHASE 2A |
IPC A 610 VIETNAMESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
MIL-PRF-83446-37 Revision A:2011 | COILS, RADIO FREQUENCY, CHIP, OPEN CONSTRUCTION, SURFACE MOUNT, 0805 SIZE |
MIL-PRF-39010-15 Base Document:2013 | COILS, RADIO FREQUENCY, OPEN CONSTRUCTION, CERAMIC CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY |
DSCC 06009 : A | RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.25 WATT), STYLE 1206 |
DSCC 06010 : B | RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.5 WATT), STYLE 2010 |
DSCC 15010 : A | CAPACITOR, TANTALUM, HYBRID, HERMETICALLY SEALED |
BS EN 60810:2015 | Lamps for road vehicles. Performance requirements |
DSCC 06007 : A | RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.1 WATT), STYLE 0603 |
VDE 0468-2-69 : 2018 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
ASTM B 965 : 2009 : R2014 | Standard Specification for High Performance Tin-Coated Annealed Copper Wire Intended for Electrical and Electronic Application for Solderability |
PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
I.S. EN 61191-4:2017 | PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
I.S. EN 61191-3:2017 | PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC WHMA A 620 DANISH : B | REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES |
IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
DSCC 04003 : E | CAPACITOR, TANTALUM, HYBRID, HERMETICALLY SEALED |
DSCC 06008 : A | RESISTOR, CHIP, FIXED, POWER METAL STRIP, SURFACE MOUNT, LOW VALUE (.125 WATT), STYLE 0805 |
EN 60068-2-69:2017/AC:2018-03 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018) |
I.S. EN 60810:2015 | LAMPS FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
MIL-PRF-32560-2 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, MOLDED, SHIELDED ESTABLISHED RELIABILITY, SURFACE MOUNT |
MIL-PRF-32560-1 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, CONFORMAL COATED, ESTABLISHED RELIABILITY, SURFACE MOUNT |
MIL-PRF-32560-6 Base Document:2016 | COIL, RADIO FREQUENCY, CHIP, FIXED, OPEN CONSTRUCTION ESTABLISHED RELIABILITY, SURFACE MOUNT, 0603 SIZE |
DIN EN 60068-2-69 : 2007 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
BS EN 61191-4:2017 | Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
IPC J STD 075 : 0 | CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
I.S. EN IEC 60810:2018 | LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
MIL-PRF-39010-16 Base Document:2013 | COILS, RADIO FREQUENCY, OPEN CONSTRUCTION, FERRITE CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY |
SAE J 2685 : 2014 | POSITIVE TEMPERATURE COEFFICIENT OVERCURRENT PROTECTION DEVICES (PTCS) |
IEC PAS 62686-2:2016 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components |
I.S. EN 60068-2-69:2017 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
EN IEC 60810:2018 | Lamps, light sources and led packages for road vehicles - Performance requirements |
BS EN IEC 60810:2018 | Lamps, light sources and led packages for road vehicles. Performance requirements |
IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
IEC TS 62668-2:2016 | Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
16/30350012 DC : 0 | BS EN 60810 - LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS |
PD IEC/PAS 62686-2:2016 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for passive components |
IEC PAS 62647-1:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
15/30327712 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
PD IEC/PAS 62647-1:2011 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
IEC 62435-5:2017 | Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
BS EN 62435-5:2017 | Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
PD IEC/TS 62668-2:2016 | Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources |
IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
MIL-PRF-83421 Revision F:2017 | CAPACITOR, FIXED, METALLIZED PLASTIC FILM DIELECTRIC, (DC, AC, OR DC AND AC), HERMETICALLY SEALED IN METAL CASES OR CERAMIC CASES, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
MIL-PRF-10304 Revision F:1999 | METERS, ELECTRICAL INDICATING, PANEL TYPE, RUGGEDIZED, GENERAL SPECIFICATION FOR |
BS EN 60068-2-69:2017 | Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
SAE AS 22759 : 2014 | WIRE, ELECTRICAL, FLUOROPOLYMER-INSULATED, COPPER OR COPPER ALLOY |
SAE AS 29606 : 2014 | WIRE, ELECTRICAL, STRANDED, UNINSULATED COPPER, COPPER ALLOY, OR ALUMINUM, OR THERMOCOUPLE EXTENSION, GENERAL SPECIFICATION FOR |
EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
IEC TS 62861:2017 | Guidelines for principal component reliability testing for LED light sources and LED luminaires |
MIL-PRF-20 Revision N:2017 | CAPACITOR, FIXED, CERAMIC DIELECTRIC, (TEMPERATURE COMPENSATING), ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
MIL PRF 55365 : 0012 | CAPACITOR, FIXED, ELECTROLYTIC (TANTALUM), CHIP, ESTABLISHED RELIABILITY, NON-ESTABLISHED RELIABILITY, AND HIGH RELIABILITY, GENERAL SPECIFICATION FOR |
EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
SAE AS 6324 : 2017 | VERIFICATION OF NEW CONDUCTOR ALLOYS FOR AS29606 CONDUCTORS QUALIFICATION |
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