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JEDEC JESD 51-9:2000

Current

Current

The latest, up-to-date edition.

Test Boards for Area Array Surface Mount Package Thermal Measurements

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

07-01-2000

This specification is meant to be broad enough to incorporate a wide variety of surface mount area array package (e.g., BGA) design features and technologies.

DocumentType
Standard
Pages
22
PublisherName
JEDEC Solid State Technology Association
Status
Current

CEI EN IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly

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