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JIS C 0099:2005

Withdrawn
Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

View Superseded by
withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Environmental testing: Tests - Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
Available format(s)

Hardcopy , PDF

Withdrawn date

09-22-2014

Language(s)

Japanese, English

Published date

03-20-2005

Publisher

Japanese Standards Association

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This Japanese Industrial Standard specifies the methods for testing the solderability of the metal terminal or the electrode of the surface mounting devices mounted on a printed wiring board by wetting balance using lead-free solder paste.

DocumentType
Standard
Pages
0
PublisherName
Japanese Standards Association
Status
Withdrawn
SupersededBy

JIS Z 3284:1994 Solder paste
JIS K 0066:1992 Test methods for distillation of chemical products
JIS H 3100:2006 Copper and copper alloy sheets, plates and strips
JIS C 60068-2-54:1996 Environmental testing Part 2: tests. Test Ta: Soldering. Solderability testing by the wetting balance method
JIS K 0068:2001 Test methods for water content of chemical products
JIS K 5902:1969 Colophonium
JIS K 0114:2000 General rules for gas chromatographic analysis
JIS Z 3197:1999 Testing methods for soldering fluxes
JIS K 0064:1992 Test methods for melting point and melting range of chemical products
JIS C 60068-2-20:1996 Basic environmental testing procedures Part 2: Tests. Test T: Soldering
JIS C 5602:1986 Glossary of passive components for electronic equipment
JIS K 0067:1992 Test methods for loss and residue of chemical products
JIS K 0070:1992 Test methods for acid value, saponification value, ester value, iodine value, hydroxyl value and unsaponifiable matter of chemical products
JIS C 60068-2-58:2006 Environmental Testing - Part 2: Tests - Test Td: Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
JIS C 60068-1:1993 Environmental testing Part 1: General and guidance

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Hardcopy - Japanese
Hardcopy - English
PDF - English
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