JIS C 5202:1990

1 Scope2 Definitions3 Conditions for test 3.1 Standard conditions 3.2 Reference conditions 3.3 Referee conditions 3.4 Drying 3.4.1 Drying conditions 3.4.2 Dry storage 3.4.3 Items to be specificed in detail 3.5 Standard recovery conditions4 Appearance and dimension tests 4.1 Appearance 4.2 Marking 4.3 Dimension5 Electrical performance tests 5.1 Resistance 5.2 Temperature characteristic of resistance and deviation in resistance value 5.3 Voltage coefficient 5.4 Temperature rise 5.5 Short-time overload 5.6 Insulation resistance 5.7 Dielectric withstand voltage 5.8 Intermittent overload 5.9 Noise 5.10 High-frequency characteristic 5.11 Withstand to pulse 5.12 Reactance6 Mechanical performance tests 6.1 Robustness of termination 6.1.1 Equipment 6.1.2 Test method 1 (applicable for resistors other than SMD) 6.1.3 Items to be specified in detail specification 6.1.4 Test method 2 (applicable for SMD) 6.1.5 Items to be specified in detail specification 6.2 Robustness of resistor body 6.2.1 Tests (1) Method 1 (applicable for resistors with a body length exceeding 25 mm) (2) Method 2 (applicable for SMD) 6.3 Resistance to vibration 6.4 Resistance to soldering heat 6.5 Solderability 6.6 Sealing 6.7 Shock 6.8 Radiographic examination 6.9 Resistance to solvent 6.10 Resistance to soldering heat (applicable for SMD) 6.11 Solderability (applicable for SMD) 6.12 Resistance of electrode to soldering damage (applicable for SMD) 6.13 Bump7 Environmental tests 7.1 Resistance to cold 7.2 Resistance to dry heat 7.3 Heat shock 7.4 Change of temperature (cycle) 7.5 Resistance to damp heat (steady state) 7.6 Resistance to damp heat (cyclic) 7.7 Salt mist 7.8 Immersion cycle sealing 7.9 Endurance (under damp and load) 7.10 Endurance (rated load) 7.11 Stability 7.12 Flame retardance 7.13 Climatic sequenceAttached Table 1Annex 1Annex 2