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JIS C 6471:1995

Current
Current

The latest, up-to-date edition.

Test methods of copper-clad laminates for flexible printed wiring boards
Available format(s)

Hardcopy , PDF

Language(s)

English, Japanese

Published date

04-30-1995

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This Japanese Industrial Standard specifies test methods of copper-clad laminates for flexible printed wiring boards (hereafter referred to as "copper-clad laminates").

DocumentType
Test Method
Pages
35
PublisherName
Japanese Standards Association
Status
Current

Reaffirmed 2014 1995(R2014) [20/10/2014]1995(R2009) [01/10/2009]1995(R2000) [20/03/2000]1995 [01/03/1995]1990

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JIS C 6472:1995 Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)

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