Test methods for lead-free solders Part 4: Methods for solderbility test by a wetting balance method and a contact angle method

Available format(s)

Hardcopy , PDF

Language(s)

English, Japanese

Published date

06-20-2003

Publisher

Japanese Standards Association

This Standard specifies the methods for solderability test of a wetting balance method and a contact angle method of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.

DocumentType	Standard
Pages	14
PublisherName	Japanese Standards Association
Status	Current

Reaffirmed 2013 2003(R2013) [21/10/2013]2003(R2008) [01/10/2008]2003 [20/06/2003]

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