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JIS Z 3284:1994

JIS Z 3284:1994

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

View Superseded by
withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Solder paste

Available format(s)

Hardcopy , PDF

Withdrawn date

06-20-2014

Language(s)

English, Japanese

Published date

02-15-2008

Publisher

Japanese Standards Association

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This Japanese Industrial Standard specifies the solder paste to be used in the wiring connection of electrical equipments, electronic equipments, communication equipment or the like, and in manufacturing the parts thereof.

DocumentType
Standard
Pages
47
PublisherName
Japanese Standards Association
Status
Withdrawn
SupersededBy

Reaffirmed 2010

JIS H 3100:2006 Copper and copper alloy sheets, plates and strips
JIS Z 3282:2006 Soft solders - Chemical compositions and forms
JIS Z 3197:1999 Testing methods for soldering fluxes
JIS C 6480:1994 General rules of copper-clad laminates for printed wiring boards

JIS Z 3197:1999 Testing methods for soldering fluxes
JIS Z 3198-6:2003 Test methods for lead-free solders Part 6: Methods for 45°pull test of solder joints on QFP lead
JIS Z 3282:2006 Soft solders - Chemical compositions and forms
JIS C 0099:2005 Environmental testing: Tests - Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
JIS Z 3198-3:2003 Test methods for lead-free solders Part 3: Methods for spread test
JIS Z 3198-7:2003 Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components Part 7: Methods for shear strength of solder joints on chip components
JIS C 61191-1:2006 Printed Board Assemblies - Part 1: Generic Specification - Requirements For Soldered Electrical And Electronic Assemblies Using Surface Mount And Related Assembly Technologies

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Hardcopy - English
PDF - English
Hardcopy - Japanese
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