MIL-STD-202-210 Notice 1 - Validation:2020
Current
Current
The latest, up-to-date edition.
Method 210, Resistance to Soldering Heat
Amendment of
Available format(s)
PDF
Language(s)
English
Published date
01-22-2020
Publisher
This test is performed to determine whether wire and other component parts can withstand the effects of the heat to which they will be subjected during the soldering process (solder iron, solder dip, solder wave, or solder reflow).
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