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    • Electronic component assemblies
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    IEC 62878-1-1 : 1.0

    DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS

    International Electrotechnical Committee

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    IEC 62878-2-5:2019

    Device embedding assembly technology – Part 2-5: Guidelines – Implementation of a 3D data format for device embedded substrate

    International Electrotechnical Committee

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    IEC 60068-2-69 : 2017+AMD 1 : 2019

    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    International Electrotechnical Committee

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    IEC 61191-1:2018

    Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

    International Electrotechnical Committee

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    IEC 60194-2 : 1.0

    PRINTED BOARDS DESIGN, MANUFACTURE AND ASSEMBLY - VOCABULARY - PART 2: COMMON USAGE IN ELECTRONIC TECHNOLOGIES AS WELL AS PRINTED BOARD AND ELECTRONIC ASSEMBLY TECHNOLOGIES

    International Electrotechnical Committee

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    IEC 61190-1-3 : 3.0

    ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

    International Electrotechnical Committee

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    IEC 60068-2-58 : 4.1

    ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)

    International Electrotechnical Committee

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    IEC 61191-2 : 3.0

    PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES

    International Electrotechnical Committee

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    IEC 62090 : 2.0

    PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES

    International Electrotechnical Committee

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    IEC 62739-3 : 1ED 2017

    TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS

    International Electrotechnical Committee

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