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    • Printed circuits and boards
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    IEC 62899-202-6:2020

    Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate

    International Electrotechnical Committee

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    IEC 62899-402-2:2020

    Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness

    International Electrotechnical Committee

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    IEC 62878-1-1 : 1.0

    DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS

    International Electrotechnical Committee

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    IEC 62878-2-5:2019

    Device embedding assembly technology – Part 2-5: Guidelines – Implementation of a 3D data format for device embedded substrate

    International Electrotechnical Committee

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    IEC 62899-204:2019

    Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers

    International Electrotechnical Committee

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    IEC 61188-6-4:2019

    Printed boards and printed board assemblies – Design and use – Part 6-4: Land pattern design – Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

    International Electrotechnical Committee

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    IEC 62899-202-3:2019

    Printed electronics – Part 202-3: Materials – Conductive ink – Measurement of sheet resistance of conductive films – Contactless method

    International Electrotechnical Committee

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    IEC 62899-201:2016+AMD1:2018 CSV

    Printed electronics - Part 201: Materials - Substrates

    International Electrotechnical Committee

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    IEC 62899-202-5 : 2018

    Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

    International Electrotechnical Committee

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    IEC 62899-403-1:2018

    Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine

    International Electrotechnical Committee

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