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    IPC A 600 : G : AMD 1

    ACCEPTABILITY OF PRINTED BOARDS

    Institute of Printed Circuits

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    IPC A 610 : D : ERR 1

    ACCEPTABILITY OF ELECTRONIC ASSEMBLIES

    Institute of Printed Circuits

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    IPC WHMA A 620 : B : AMD 1

    REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES

    Institute of Printed Circuits

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    IPC 4552 : 0 : AMD 1

    PERFORMANCE SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATING FOR PRINTED BOARDS

    Institute of Printed Circuits

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    J STD 005 JAPANESE : 0

    REQUIREMENTS FOR SOLDERING PASTES

    Institute of Printed Circuits

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    J STD 005 CHINESE : A

    REQUIREMENTS FOR SOLDERING PASTES

    Institute of Printed Circuits

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    J STD 005 CHINESE : 0

    REQUIREMENTS FOR SOLDERING PASTES

    Institute of Printed Circuits

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    IPC 9504 : 0

    ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS)

    Institute of Printed Circuits

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    IPC 4130 : 0

    SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN 'E' GLASS MATERIALS

    Institute of Printed Circuits

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    IPC 2223 : C

    SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS

    Institute of Printed Circuits

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